Circuit Board Layout

Video course on DVDs:

Circuit Board Layout to Reduce Electromagnetic Emission and Susceptibility

A 5-Hour Video Presentation on DVD

Program Description

The course covers circuit board layout issues that span the frequency range from DC to several GHz.  Mixed analog and digital designs, and multilayer boards are emphasized.  Most of the concepts and techniques presented are applicable to one- and two-sided board designs.  Several key concepts are illustrated with demonstrations.  You will also learn techniques for diagnosing electromagnetic interference problems at the board level.

This course shows that the issues of safety, emission, and susceptibility can be used to determine if, where, and how to connect the circuit board to a metal enclosure.  Each specific case has its own unique result, but all conclusions are based on the same electromagnetic compatibility principles.

Benefits

This course will help you to:

  • Design or manufacture electronic equipment
  • Design printed circuit boards
  • Design metal enclosures for circuit boards
  • Select connectors and cables attached to circuit boards
  • Design integrated circuits and packages
  • Design filters to reduce conducted emissions
  • Select heat sinks for integrated circuit packages
  • Test for electromagnetic compatibility of products containing circuit boards

Learning Objectives

  • Explain why wiring inductance is more important than resistance
  • Describe how current loop area is related to self inductance
  • Explain how resonances worsen circuit board emission and immunity
  • Determine which nets should be terminated as transmission lines
  • Describe the four noise-coupling mechanisms
  • Describe two ways to reduce each of the four coupling mechanisms
  • Explain the two reasons for grounding
  • Explain the difference between a grounding conductor and a signal return conductor
  • Explain why a signal should be grounded to an external metal enclosure
  • Explain when to use series blocking and shunt diverting filter techniques
  • Understand the problem with mutual inductance between the input and output loops of shunt capacitors
  • Recognize trace layouts that have excessive inductance
  • Design more effective DC power-distribution busses
  • Understand the advantages of alternative layer stackup configurations

Course Outline

Session 1:
1.  Introduction
2.  Signal Routing and the Path of Least Impedance
3.  Transmission Line Effects

Session 2:
3.  Transmission Line Effects (cont.)
4.  Noise Coupling Mechanisms

Session 3:
5.  Circuit Board Grounding Issues
6.  Filtering Conducted Noise

Session 4:
7.  DC Power Distribution and Decoupling 

Session 5:
8.  Component Placement and Layer Stackup
9.  Chassis, Cable, and System Issues
10. Review of EMC Principles and Board Layout Guidelines

APPENDIX 1  A Review of Background Material
APPENDIX 2  A Summary of EMC Guidelines for Circuit Board Layout

Price Options

Single User--$600
Multiple Users--$1500
Site License--$4000
(The site license allows the content to be placed on a company network at a single location.)

To place an order:

Contact Tom Van Doren at vandoren@mst.edu